ARES Large surface printing platform for flexible electronics
ARES (Large surface printing platform for flexible anf hybrid electronics), led by CEA (FR), brings together all necessary advanced printing equipment – vacuum coating, screen printing, inkjet, gravure, flexography, thermoforming tools and slot-die, as well as back-end assembly tools (lamination, pick and place) in a 1000 m2 Platform of clean room ISO7 class 10000.
Project: DIMOFAC
Publisher: CEA
Technology: Flexible Electronics
Industry: Medical, Packaging, Automotive, Smart homes, Energy
INTRODUCTION
Liten’s printing techniques are compatible with large areas (up to 32 cm x 38 cm) and offer the added benefit of being able to develop 2D/3D smart objects functionalized using multiple electronic components on a myriad of substrates (from plastic and glass to paper and stretchable substrates). The electronic functions design can be customized according to the application. As an example, in IoT application, CEA offers technological building blocks such as antenna, sensors and chip bonding enabling the development of smart POC demonstrators able to communicate relevant data to a larger IT system.
FEATURES/BENEFITS
- Services:
- Introduction to printed and hybrid electronics: Introduction to printed and hybrid electronics - 1/2 day training - Overview / Advantages - Manufacturing Process - Technologies portfolio - Applications/ several exemples of Prototypes - Visit of the facilities (clean room). Additional ½ day: The visit might be coupled with a identification of R&D relevant subjects with the visitors.
- Benefits: Introduction of functionality in the product for smart and/or traceability applications
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